07XSC200 データシートの表示（PDF） - Freescale Semiconductor

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07XSC200

Dual High Side Switch (7.0 mOhm)

Freescale Semiconductor 

3 Electrical Characteristics

3.1 Maximum Ratings

Table 2. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent

damage to the device.

Ratings

Symbol

Value

Unit

ELECTRICAL RATINGS

VPWR Supply Voltage Range

• Load Dump at 25 °C (400 ms)

• Maximum Operating Voltage

• Reverse Battery

VPWR(SS)

V

41

28

-18

VDD Supply Voltage Range

Input / Output Voltage

WAKE Input Clamp Current

CSNS Input Clamp Current

HS [0:1] Voltage

• Positive

• Negative

VDD

-0.3 to 5.5

V

(4)

-0.3 to VDD+0.3

V

ICL(WAKE)

2.5

mA

ICL(CSNS)

2.5

mA

VHS[0:1]

V

41

-24

Output Current per Channel

• Nominal Continuous Current(1)

• Short-circuit Transient Current

• Reverse Continuous Current(1)

IHS[0:1]

A

26

116

-26

High Side Breakdown Voltage

HS[0,1] Output Clamp Energy using single pulse method(2)

ESD Voltage(3)

• Human Body Model (HBM) for HS[0:1], VPWR and GND

• Human Body Model (HBM) for other pins

• Charge Device Model (CDM)

Corner Pins (1, 27, 28, 57)

All Other Pins

VPWR - VHS

47

V

ECL [0:1]

100

mJ

V

VESD1

VESD2

± 8000

± 2000

VESD3

VESD4

± 750

± 500

Notes

1. Continuous high side output current rating so long as maximum junction temperature is not exceeded. Calculation of maximum output

current using board thermal resistance is required.

2. Active clamp energy using single-pulse method (L = 2.0 mH, RL = 0 , VPWR = 14 V, TJ = 150 C initial).

3. ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 ), the Machine Model (MM)

(CZAP = 200 pF, RZAP = 0 ), and the Charge Device Model (CDM), Robotic (CZAP = 4.0 pF).

4. Input / Output pins are: IN[0:1], CLOCK, RSTB, FSI, CSNS, SI, SCLK, CSB, SO, FSB

Analog Integrated Circuit Device Data

Freescale Semiconductor

07XSC200

5

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