The Intel StrataFlash® Embedded Memory (P30) product is the latest generation of Intel StrataFlash® memory devices. Offered in 64-Mbit up through 1-Gbit densities, the P30 device brings reliable, two-bit-per-cell storage technology to the embedded flash market segment. Benefits include more density in less space, high-speed interface, lowest cost-per-bit NOR device, and support for code and data storage. Features include high-performance synchronousburst read mode, fast asynchronous access times, low power, flexible security options, and three industry standard package choices.
   
Product Features
■ High performance
    — 85/88 ns initial access
    — 40 MHz with zero wait states, 20 ns clock-to-data output
        synchronous-burst read mode
    — 25 ns asynchronous-page read mode
    — 4-, 8-, 16-, and continuous-word burst mode
    — Buffered Enhanced Factory Programming
        (BEFP) at 5 µs/byte (Typ)
    — 1.8 V buffered programming at 7 µs/byte (Typ)
■ Architecture
    — Multi-Level Cell Technology: Highest Density
        at Lowest Cost
    — Asymmetrically-blocked architecture
    — Four 32-KByte parameter blocks: top or
        bottom configuration
    — 128-KByte main blocks
■ Voltage and Power
    — VCC (core) voltage: 1.7 V – 2.0 V
    — VCCQ (I/O) voltage: 1.7 V – 3.6 V
    — Standby current: 55 µA (Typ) for 256-Mbit
    — 4-Word synchronous read current:
        13 mA (Typ) at 40 MHz
■ Quality and Reliability
    — Operating temperature: –40 °C to +85 °C
        • 1-Gbit in SCSP is –30 °C to +85 °C
    — Minimum 100,000 erase cycles per block
    — ETOX™ VIII process technology (130 nm)
■ Security
    — One-Time Programmable Registers:
        • 64 unique factory device identifier bits
        • 64 user-programmable OTP bits
        • Additional 2048 user-programmable OTP bits
    — Selectable OTP Space in Main Array:
        • 4x32KB parameter blocks + 3x128KB main
        blocks (top or bottom configuration)
    — Absolute write protection: VPP = VSS
    — Power-transition erase/program lockout
    — Individual zero-latency block locking
    — Individual block lock-down
■ Software
    — 20 µs (Typ) program suspend
    — 20 µs (Typ) erase suspend
    — Intel® Flash Data Integrator optimized
    — Basic Command Set and Extended Command
        Set compatible
    — Common Flash Interface capable
■ Density and Packaging
    — 64/128/256-Mbit densities in 56-Lead TSOP
        package
    — 64/128/256/512-Mbit densities in 64-Ball
        Intel® Easy BGA package
    — 64/128/256/512-Mbit and 1-Gbit densities in
        Intel® QUAD+ SCSP
    — 16-bit wide data bus