MS5F5617 データシートの表示（PDF） - Fuji Electric

部品番号

コンポーネント説明

一致するリスト

MS5F5617

IGBT module

Fuji Electric 

Reliability Test Results

Test

cate-

gorie

s

Test items

1 Terminal Strength

(Pull test)

2 Mounting Strength

3 Vibration

4 Shock

1 High Temperature Storage

Reference

norms

EIAJ ED-4701

(Aug.-2001 edition)

Number

of test

sample

Number

of

failure

sample

Test Method 401

5

0

MethodⅠ

Test Method 402

5

0

methodⅡ

Test Method 403 5

0

Condition code B

Test Method 404

5

0

Condition code B

Test Method 201

5

0

2 Low Temperature Storage

Test Method 202

5

0

3 Temperature Humidity

Storage

4 Unsaturated

Pressure Cooker

5 Temperature Cycle

Test Method 103

5

0

Test code C

Test Method 103

5

0

Test code E

Test Method 105

5

0

6 Thermal Shock

Test Method 307

5

0

method Ⅰ

Condition code A

1 High temperature Reverse Bias Test Method 101 5

0

2 High temperature Bias

Test Method 101

5

0

( for gate )

3 Temperature Humidity Bias

Test Method 102

5

0

Condition code C

4 Intermitted Operating Life

Test Method 106

5

0

(Power cycling)

( for IGBT )

MS5F 5617

a

8

13

H04-004-03a

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