MS5F5617 データシートの表示（PDF） - Fuji Electric

部品番号

コンポーネント説明

一致するリスト

MS5F5617

IGBT module

Fuji Electric 

5. Thermal resistance characteristics

Items

Symbols

Conditions

Characteristics

min.

typ.

max.

Thermal resistance(1device)

Rth(j-c)

IGBT

FWD

-

-

0.125

-

-

0.23

Contact Thermal resistance

Rth(c-f) with Thermal Compound (※)

-

0.025

-

※ This is the value which is defined mounting on the additional cooling fin with thermal compound.

Units

℃/W

6. Indication on module

Logo of production

2MBI300U2B-060

300A 600V

Lot.No.

Place of manufacturing (code)

7.Applicable category

This specification is applied to IGBT Module named 2MBI300U2B-060 .

8.Storage and transportation notes

・ The module should be stored at a standard temperature of 5 to 35℃ and humidity of 45 to 75% .

・ Store modules in a place with few temperature changes in order to avoid condensation on the module surface.

・ Avoid exposure to corrosive gases and dust.

・ Avoid excessive external force on the module.

・ Store modules with unprocessed terminals.

・ Do not drop or otherwise shock the modules when transporting.

9. Definitions of switching time

L

RG

VGE

V CE

Ic

10. Packing and Labeling

Display on the packing box

- Logo of production

- Type name

- Lot No

- Products quantity in a packing box

0V

V GE

VCE

Vcc

0V Ic

0A

90%

trr

90%

Irr

Ic

10%

10%

tr(i)

tr

ton

VCE

toff

0V

90%

10%

tf

MS5F 5617

a

5

13

H04-004-03a

Share Link: