FEATURE
• Low profile space
• Ideal for automated placement
• Glass passivated chip junction
• Low forward voltage drop
• Low leakage curret
• High forward voltage drop
• High temperature soldering:
   260℃/10 seconds at terminals.
• Component in accordance to
   RoHS 2002/95/1 and WEEE 2002/96/EC

MECHANICAL DATA
• Case: JEDEc DO-214AC molded plastic
   over glass passivated chip
• Terminal: Solder plated, solderable per
   J-STD-002B and JESD22-B102D
• Polarity: Laser band denotes cathode end