Reverse Voltage - 50 to 1000 Volts Forward Current - 0.3 Ampere

FEATUREs
✦ Low profile space
✦ Ideal for automated placement
✦ Glass passivated chip junctions
✦ Low forward voltage drop
✦ Low leakage current
✦ High forward surge capability
✦ High temperature soldering：
   260℃/10 seconds at terminals
✦ Component in accordance to
   RoHS 2002/95/1 and WEEE 2002/96/EC

Mechanical Date
   Case: JEDEC SOD-123FL molded plastic
   body over glass passivated chip
   Terminals: Solder plated, solderable per
   J-STD-002B and JESD22-B102D
   Polarity: Laser band denotes cathode end
   Weight: 0.017gram