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DSP8(2003) データシート - IXYS CORPORATION

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DSP8

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IXYS
IXYS CORPORATION IXYS

Phase-leg Rectifier Diode ISOPLUS220™ Electrically Isolated Back Surface


FEATUREs
• Silicon chip on Direct-Copper-Bond substrate
    - High power dissipation
    - Isolated mounting surface
    - 2500V electrical isolation
• For single and three phase bridge configuration
• Low cathode to tab capacitance (<15pF)
• Planar passivated chips
• Epoxy meets UL 94V-0


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