DSEE6-06CC データシート - IXYS CORPORATION
メーカー
![IXYS](/logo/IXYS.png)
IXYS CORPORATION
![IXYS](data:image/gif;base64,R0lGODlhAQABAIAAAAAAAP///yH5BAEAAAAALAAAAAABAAEAAAIBRAA7)
Features
• Silicon chip on Direct-Copper-Bond substrate
- High power dissipation
- Isolated mounting surface
- 2500V electrical isolation
• Low cathode to tab capacitance (<15pF)
• Planar passivated chips
• Very short recovery time
• Extremely low switching losses
• Low IRM-values
• Soft recovery behaviour
• Epoxy meets UL 94V-0
APPLICATIONs
• Antiparallel diode for high frequency switching devices
• Antisaturation diode
• Snubber diode
• Free wheeling diode in converters and motor control circuits
• Rectifiers in switch mode power supplies (SMPS)
• Inductive heating
• Uninterruptible power supplies (UPS)
• Ultrasonic cleaners and welders
HiPerDynFREDTM Epitaxial Diode with soft recovery (Electrically Isolated Back Surface)
IXYS CORPORATION
HiPerFRED™ Epitaxial Diode ISOPLUS220™ Electrically Isolated Back Surface
IXYS CORPORATION
HiPerFRED™ Epitaxial Diode ISOPLUS220™ Electrically Isolated Back Surface
IXYS CORPORATION
HiPerFRED™ Epitaxial Diode ISOPLUS220™ Electrically Isolated Back Surface
IXYS CORPORATION
HiPerDynFRED™ Epitaxial Diode ISOPLUS220™ Electrically Isolated Back Surface ( Rev : 2001 )
IXYS CORPORATION
HiPerDynFRED™ Epitaxial Diode ISOPLUS220™ Electrically Isolated Back Surface
IXYS CORPORATION
HiPerDynFRED™ Epitaxial Diode ISOPLUS220™ Electrically Isolated Back Surface
IXYS CORPORATION
HiPerDynFRED™ Epitaxial Diode ISOPLUS220™ Electrically Isolated Back Surface
IXYS CORPORATION
HiPerDynFRED™ Epitaxial Diode ISOPLUS220™ Electrically Isolated Back Surface
IXYS CORPORATION
HiPerDyn™ Schottky Diode (Electrically Isolated Back Surface)
IXYS CORPORATION