10XSD200 データシートの表示（PDF） - Freescale Semiconductor
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10XSD200 Datasheet PDF : 60 Pages
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ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are relative to ground unless mentioned otherwise. Exceeding these ratings may cause permanent damage.
Parameter
Symbol
Maximum ratings
Unit
ELECTRICAL RATINGS
VPWR Supply Voltage Range
Voltage Transient at 25 °C (500 ms)
VPWR
V
58
Reverse Voltage at 25 °C
-28
Fast Negative Transient Pulses (ISO 7637-2 pulse #1, VPWR=14 V & RI=10 )
-60
VDD Supply Voltage Range
VDD
-0.3 to 5.5
V
Voltage on Input pins (6) (except IN[0:1]) and Output pins (7) (except HS[0:1])
VMAX,LOGIC(6)
-0.3 to 5.5
V
Voltage on Fail-safe Output (FSOB)
VFSO
-0.3 to 58
V
Voltage on SO pin
VSO
-0.3 to VDD+0.3
V
Voltage (continuous, max. allowable) on IN[0:1] Inputs
VIN,MAX
58
V
Voltage (continuous, max. allowable) on output pins (HS [0:1]),
Rated Continuous Output Current per channel(1)
VHS[0:1]
-28 to 58
V
IHS[0:1]
6.0
A
Maximum allowable energy dissipation per channel and two parallel channels,
single-pulse method(2)
ECL [0:1]_SING
300
mJ
Maximum allowable energy dissipation per channel and two parallel channels,
repetitive-pulses condition. 1(3)
ECL [0:1]_REP1
220
mJ
Maximum allowable energy dissipation per channel and two parallel channels,
repetitive-pulses condition. 2(4)
ECL [0:1]_REP2
220
mJ
ESD Voltage(5)
Human Body Model (HBM) for HS[0:1], VPWR and GND
Human Body Model (HBM) for other pins
Charge Device Model (CDM)
Package Corner pins (1, 13, 19, 20)
All Other pins
V
VESD1
VESD2
± 8000
± 2000
VESD3
VESD4
± 750
± 500
Notes:
1. Output current rating valid as long as maximum junction temperature is not exceeded. For computation of the maximum allowable output
current, the thermal resistance of the package & the underlying heatsink must be taken into account
2. Single pulse Energy dissipation, Single-pulse short-circuit method (LL = 2.0 mH, R = 30 mVPWR = 28 V, TJ = 150 C initial).
3. Dissipation during repetitive cycles: switch off upon short-circuit (LL = 20 µH, R = 200 mVPWR = 28 V, TJ = 125 C initial, fS<2.0 Hz).
4. Dissipation during repetitive cycles: switch off upon short-circuit (LL = 40 µH, R = 400 mVPWR = 28 V, TJ = 125 C initial, fS<2.0 Hz).
5. ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 ), and the Charge Device
Model (CDM), Robotic (CZAP = 4.0 pF).
6. Concerned Input pins are: CONF[0:1], RSTB, SI, SCLK, Clock, and CSB.
7. Concerned Output pins are: CSNS, SYNC, and FSB.
10XSD200
6
Analog Integrated Circuit Device Data
Freescale Semiconductor
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