TGA1141-EPU データシートの表示（PDF） - TriQuint Semiconductor
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TGA1141-EPU Datasheet PDF : 9 Pages
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Advance Product Information
August 27, 2003
TGA1141-EPU
Chip Assembly and Bonding Diagram
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice
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TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com
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