MPVZ5150(2006) データシートの表示（PDF） - Freescale Semiconductor
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MPVZ5150
(Rev.:2006)
(Rev.:2006)
Freescale Semiconductor
MPVZ5150 Datasheet PDF : 7 Pages
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PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorocarbon gel
which protects the die from harsh media. The MPX pressure
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using Table 3
below.
TABLE 3. PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
MPVZ5150GC6T1
MPVZ5150GC7U
Part Number
Case Type
482A
482C
Pressure (P1) Side Identifier
Top with Port Attached
Top with Port Attached
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
between the board and the package. With the correct
shorting between solder.
Figure 5. Small Outline Package Footprint
Sensors
Freescale Semiconductor
MPVZ5150
5
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