MPVZ5150(2006) データシートの表示（PDF） - Freescale Semiconductor
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MPVZ5150
(Rev.:2006)
(Rev.:2006)
Freescale Semiconductor
MPVZ5150 Datasheet PDF : 7 Pages
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ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
Figure 2 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 4. The
output will saturate outside of the specified pressure range.
Figure 3 illustrates the Differential or Gauge configuration
in the basic chip carrier (Case 482). A gel isolates the die
surface and wire bonds from the environment, while allowing
the pressure signal to be transmitted to the silicon diaphragm.
Operating characteristics, internal reliability and qualification
tests are based on use of dry clean air as the pressure media.
Media other than dry clean air may have adverse effects on
sensor performance and long term reliability. Contact the
factory for information regarding media compatibility in your
application.
5
Vout = VS*(0.006*P(kPa)+0.04)
± (PE * TM * 0.006 * Vs)
4 VS = 5.0 V ± 0.25 Vdc
PE = 3.75 kPa
TM = 1 @ 0 to 85°C
3
TM = 3 @ +125°C
TM = 3 @ -40°C
Vs = 5.0 V +/- 0.25 Vdc
2 MAX
MIN
1
TYP
0
Pressure (kPa)
(Typ)
Offset
Figure 2. Output Vs. Pressure Differential
Gel Die Coat
Wire Bond
Die
P1
Stainless
Steel Cap
Thermoplastic
Case
Lead Frame
P2
Differential Sensing
Element
Die Bond
Figure 3. Cross Sectional Diagrams (Not to Scale)
Figure 4 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
+5.0 V
1.0 µF
0.01 µF
VOUT
Vs
IPS
GND
OUTPUT
470 pF
Figure 4. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646)
Sensors
Freescale Semiconductor
MPVZ5150
3
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