MC74HC245ADWR2G(2014) データシートの表示（PDF） - ON Semiconductor
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MC74HC245ADWR2G Datasheet PDF : 8 Pages
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSSOP−20 WB
CASE 948E
ISSUE D
DATE 17 FEB 2016
SCALE 2:1
0.15 (0.006) T U S
2X L/2 20
L
PIN 1
IDENT
1
0.15 (0.006) T U S
20X K REF
0.10 (0.004) M T U S V S
11
B
−U−
10
A
−V−
C
D
0.100 (0.004)
−T− SEATING
PLANE
GH
SOLDERING FOOTPRINT
J JÍÍÍ1 ÍÍÍKÍÍÍK1 ÍÍÍ
SECTION N−N
N
0.25 (0.010)
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
N
F
DETAIL E
DETAIL E
−W−
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 6.40 6.60 0.252 0.260
B 4.30 4.50 0.169 0.177
C --- 1.20 --- 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G
0.65 BSC
0.026 BSC
H 0.27 0.37 0.011 0.015
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L
6.40 BSC
0.252 BSC
M 0_ 8_ 0_ 8_
GENERIC
MARKING DIAGRAM*
7.06
1
XXXX
XXXX
ALYWG
G
16X
0.36
16X
1.26
0.65
PITCH
DIMENSIONS: MILLIMETERS
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
DOCUMENT NUMBER: 98ASH70169A
DESCRIPTION: TSSOP−20 WB
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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