MC74HC245ADWR2G(2014) データシートの表示（PDF） - ON Semiconductor
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MC74HC245ADWR2G Datasheet PDF : 8 Pages
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SCALE 1:1
20
1
D
A
11
E
10
20X b
B
0.25 M T A S B S
SOIC−20 WB
CASE 751D−05
ISSUE H
q
18X e
A
SEATING
PLANE
A1 T
c
RECOMMENDED
SOLDERING FOOTPRINT*
20X
0.52
20X
1.30
20
11
11.00
1
10
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DATE 22 APR 2015
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
MILLIMETERS
DIM MIN MAX
A 2.35 2.65
A1 0.10 0.25
b 0.35 0.49
c 0.23 0.32
D 12.65 12.95
E 7.40 7.60
e
1.27 BSC
H 10.05 10.55
h 0.25 0.75
L 0.50 0.90
q
0_ 7_
GENERIC
MARKING DIAGRAM*
20
XXXXXXXXXXX
XXXXXXXXXXX
AWLYYWWG
1
XXXXX = Specific Device Code
A
= Assembly Location
WL = Wafer Lot
YY
= Year
WW = Work Week
G
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
DOCUMENT NUMBER: 98ASB42343B
DESCRIPTION: SOIC−20 WB
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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