Brief Description
The ZSSC3224 is a sensor signal conditioner (SSC) IC for highaccuracy amplification and analog-to-digital conversion of a differential or pseudo-differential input signal. Designed for high resolution sensor module applications, the ZSSC3224 can perform offset, span, and 1st and 2nd order temperature compensation of the measured signal. Developed for correction of resistive bridge or absolute voltage sensors, it can also provide a corrected temperature output measured with an internal sensor.

FEATUREs
◾ Flexible, programmable analog front-end design; up to 24-bit
   analog-to-digital converter (ADC)
◾ Fully programmable gain amplifier for optimizing sensor
   signals: gain range 6.6 to 216 (linear)
◾ Internal auto-compensated 18-bit temperature sensor
◾ Digital compensation of individual sensor offset; 1st and 2nd
   order digital compensation of sensor gain as well as 1st and
   2nd order temperature gain and offset drift
◾ Programmable interrupt operation
◾ High-speed sensing: e.g., 18-bit conditioned sensor
   signal measurement rate >200s-1
◾ Typical sensor elements can achieve an accuracy of better
   than ±0.10% full scale output (FSO) at -40 to 85°C
◾ Integrated 26-bit calibration math digital signal
   processor (DSP)
◾ Fully corrected signal at digital output
◾ Layout customized for die-die bonding with sensor for highdensity chip-on-board assembly
◾ One-pass calibration minimizes calibration costs
◾ No external trimming, filter, or buffering components required
◾ Highly integrated CMOS design
◾ Integrated reprogrammable non-volatile memory
◾ Excellent for low-voltage and low-power battery applications
◾ Optimized for operation in calibrated resistive
   (e.g., pressure) sensor or calibrated absolute voltage (e.g.,
   thermopile) sensor modules
◾ Supply voltage range: 1.68V to 3.6V
◾ Operating mode current: ~1.0mA (typical)
◾ Sleep Mode current: 20nA (typical)
◾ Temperature resolution: <0.7mK/LSB
◾ Excellent energy-efficiency:
   with 18-bit resolution: <100pJ/step
   with 24-bit resolution: <150nJ/step
◾ Small die size
◾ Operation temperature: –40°C to +85°C
◾ Delivery options: 4.0mm x 4.0mm 24-PQFN and die for wafer
   bonding

APPLICATIONs
◾ Barometric altitude measurement for portable navigation or
   emergency call systems; altitude measurement for car
   navigation
◾ Weather forecast
◾ Fan control
◾ Industrial, pneumatic, and liquid pressure
◾ High-resolution temperature measurements
◾ Object-temperature radiation (via thermopile)