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W25Q64JV データシート - Winbond

W25Q64JV image

部品番号
W25Q64JV

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77 Pages

File Size
1.5 MB

メーカー
Winbond
Winbond Winbond

GENERAL DESCRIPTIONS
The W25Q64JV (64M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on 2.7V to 3.6V power supply with current consumption as low as 1µA for power-down. All devices are offered in space-saving packages.


FEATURES
• New Family of SpiFlash Memories
   – W25Q64JV: 64M-bit / 8M-byte
   – Standard SPI: CLK, /CS, DI, DO
   – Dual SPI: CLK, /CS, IO0, IO1
   – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
   – Software & Hardware Reset(1)
• Highest Performance Serial Flash
   – More than 100,000 erase/program cycles
   – Min. 100K Program-Erase cycles per sector
   – 133MHz Single, Dual/Quad SPI clocks
   266/532MHz equivalent Dual/Quad SPI
• Efficient “Continuous Read”
   – Continuous Read with 8/16/32/64-Byte Wrap
   – As few as 8 clocks to address memory
   – Allows true XIP (execute in place) operation
   – Outperforms X16 Parallel Flash
• Low Power, Wide Temperature Range
   – Single 2.7 to 3.6V supply
   – <1µA Power-down (typ.)
   – -40°C to +85°C operating range
• Flexible Architecture with 4KB sectors
   – Uniform Sector/Block Erase (4K/32K/64K-Byte)
   – Program 1 to 256 byte per programmable page
   – Erase/Program Suspend & Resume
• Advanced Security Features
   – Software and Hardware Write-Protect
   – Special OTP protection(1)
   – Top/Bottom, Complement array protection
   – Individual Block/Sector array protection
   – 64-Bit Unique ID for each device
   – Discoverable Parameters (SFDP) Register
   – 3X256-Bytes Security Registers
   – Volatile & Non-volatile Status Register Bits
• Space Efficient Packaging
   – 8-pin SOIC 208-mil / VSOP 208-mil
   – 8-pad WSON 6x5-mm/8x6-mm, XSON 4x4-mm
   – 16-pin SOIC 300-mil
   – 8-pin PDIP 300-mil
   – 24-ball TFBGA 8x6-mm (6x4 ball array)
   – 24-ball TFBGA 8x6-mm (6x4/5x5 ball array)
   – Contact Winbond for KGD and other options


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