Dual Power HiPerFET™ Module

Phaseleg Configuration

FEATUREs
• HiPerFET TM technology
   – low RDSon
   – unclamped inductive switching (UIS) capability
   – dv/dt ruggedness
   – fast intrinsic reverse diode
   – low gate charge
• thermistor for internal temperature measurement
• package
   – low inductive current path
   – screw connection to high current main terminals
   – use of non interchangeable connectors for auxiliary terminals possible
   – Kelvin source terminals for easy drive
   – isolated DCB ceramic base plate

APPLICATIONs
• converters with high power density and high switching speed for
   – power supplies
   – induction heating