FEATURES
• Ultra compact LLP1006-2L package
• Low package height < 0.4 mm
• 1-line ESD protection
• Low leakage current < 0.01 μA
• Low load capacitance CD = 45 pF
   (VR = 0 V; f = 1 MHz)
• ESD immunity acc. IEC 61000-4-2
   ± 30 kV contact discharge
   ± 30 kV air discharge
• High surge current acc. IEC 61000-4-5 IPP > 6 A
• Soldering can be checked by standard vision inspection.
   No X-ray necessary
• Pin plating NiPdAu (e4) no whisker growth
• e4 - precious metal (e.g. Ag, Au, NiPd, NiPdAu) (no Sn)
• PATENT(S): www.vishay.com/patents
• Material categorization: for definitions of compliance
   please see www.vishay.com/doc?99912