DESCRIPTION
In Microsemi’s new Powermite3® SMT package, these high efficiency ultrafast rectifiers offer the power handing capabilities previously found only in much larger packages. They are ideal for SMD applications that operate at high frequencies.
In addition to its size advantages, Powermite3® package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment.

KEY FEATURES
◾ High power surface mount
   package.
◾ Guard Ring die construction for
   transient protection.
◾ Silicon Schottky rectifiers no
   reverse voltage recovery.
◾ Internal heat sink locking tabs
◾ Low forward voltage.
◾ Full metallic bottom eliminates
   flux entrapment
◾ Compatible with automatic
   insertion equipment
◾ Low profile-maximum height of
   1mm supplied in 16 mm tape
   reel- 5000 units/ 13” reel.

APPLICATIONS/BENEFITS
◾ Switching and Regulating Power
   Supplies.
◾ Charge Pump Circuits.
◾ Reduces reverse recovery loss
   due to low IRM.
◾ Small foot print
   190 X 300 mils
   1:1 Actual size