Features
1.6 x 0.8 x 0.6 mm (L x W x H)
Incorportes opaque diffusing resin. Good Light diffusion−ideal for backlighting
InGaAlP Technology
Reflow soldering is possible
Standard embossed taping 4 mm pitch : T04 (4000 pcs/reel)

APPLICATIONs
Backlighting for battery−powered equipment
Low−power electronic equipment
Pilot light for compact equipment