Product Description
The TGA2925-SG HPA provides 11  •B of gain, 5.6 W of output power at 3.5 GHz and 2.5% EVM at 29 dBm output power. The device is ideally suited for high linearity, high power wireless data applications such as 802.16 and WiMax. The package has a high thermal conductivity copper alloy base. Internal partial matching simplifies system board layout by requiring a minimum of external components.

KEY FEATUREs
 • 3.5 GHz Application Frequency Range
 • 11 dB Nominal Gain
 • 2.5%EVM @29dBm OFDM signal at 3.5GHz
 • 37.5 dBm Nominal Psat
 • Internally Partially Matched
 • IMD3 -50 dBc @ 24 dBm SCL, Typical
 • Bias Conditions: 8 V @ 0.75 A (Quiescent)
 • 0.5 µm HFET Technology
 • 2 lead Cu-alloy base package

Primary Applications
 • 802.16 and WiMax
 • S-Band Power Amplifiers