DESCRIPTION
These miniature surface mount MOSFETs utilize a high cell density trench process to provide Low RDS(on) and to ensure minimal power loss and heat dissipation. Typical applications are DC-DC converters and power management in portable and battery-powered products such as computers, printers, PCMCIA cards, cellular and cordless telephones.

FEATURES
• Low RDS(on) provides higher efficiency and extends battery life.
• Low thermal impedance copper leadframe DPAK saves board space.
• Fast switching speed.
• High performance trench technology.