Features
• Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.
• Low profile surface mounted application in order to optimize board space.
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• High surge capability.
• Guardring for overvoltage protection.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
• Lead-free parts meet environmental standards of MIL-STD-19500 /228
• Suffix "-H" indicates Halogen-free parts, ex. FΜ520-H.