Features
• Very low profile - typical height of 1.1 mm
• Ideal for automated placement
• Low forward voltage drop, low power losses
• High efficiency
• Low thermal resistance
• Meets MSL level 1, per J-STD-020
• Solder dip 260 °C max. 10 s, per JESD 22-A111
• RoHS compliant package

Mechanical Data
• Case: Conform to JEDEC TO-277A; Suffix /A
• Molding compound meets UL 94 V-0 flammability