FEATURE
• Fast switching
• Glass passivated device
• Ideal for surface mouted applications
• Low reverse leakage
• Metallurgically bonded construction
• High temperature soldering guaranteed:
   250°C /10 seconds at terminals.

MECHANICAL DATA
• Case: JEDEC SOD-123FL, molded plastic over
   passivated chip
• Terminals: Solder Plated, solderable per
   MIL-STD-750, Method 2026
• Polarity: Color band denotes cathode end
• Weight: 0.006 ounces, 0.02 gram
• Mounting position: Any