FEATURES
• Superectifier structure for high reliability condition
• Patented glass-plastic encapsulation technique
• Ideal for automated placement
• Fast switching for high efficiency
• Low leakage current
• High forward surge capability
• Meets environmental standard MIL-S-19500
• Meets MSL level 1, per J-STD-020C, LF max peak of 250 °C
• Solder Dip 260 °C, 40 seconds
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
   
TYPICAL APPLICATIONS
    For use in fast switching rectification of power supply, inverters, converters, and freewheeling diodes for consumer, automotive and telecommunication.