Overview
This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. ThisMCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1 Mbyte of address space, it is capable of executing instructions athigh speed. This MCU is equipped with one CAN module and suited to in-vehicle or FA networking.
Furthermore, the data flash (1 KB x2 blocks) is embedded in the R8C/23 Group.
The difference between R8C/22 and R8C/23 Groups is only the existence of the data flash. Their peripheral functions are the same.

APPLICATIONs
Automotive, etc.