Features
• package: black SMT package, higher contrast
   by a black surface (RGB-Displays) and diffused
   resin
• feature of the device: additive mixture of color
   stimuli by independent driving of each chip
• wavelength: 625 nm (red),
   528 nm (true green), 470 nm (blue)
• viewing angle: 100°
• grouping parameter: luminous intensity,
   wavelength
• assembly methods: suitable for all
   SMT assembly methods
• soldering methods: reflow soldering
• preconditioning: acc. to JEDEC Level 2
• method of packing: 4 reels with 3,000/reel,
   ø180 mm
• ESD-withstand voltage: sensitive device
• Superior Corrosion Robustness:
   details see page 18

APPLICATIONs
• Indoor Video Walls
• full color display
• LED chips can be controlled seperately to
   display various colors including white