Features
• package: ceramic package for RGB-Displays
   with diffused silicon resin.
• feature of the device: additive mixture of color
   stimuli by independent driving of each chip; higher
   contrast by a black surface (RGB-Displays)
• wavelength: 625 nm (red), 528 nm (true green),
   470 nm (blue)
• viewing angle: Lambertian Emitter (120°)
• technology: ThinFilm (red),
   ThinGaN (true green, blue)
• optical efficiency: 45 lm/W (red),
   45 lm/W (true green), 15 lm/W (blue)
• grouping parameter: luminous intensity,
   wavelength
• assembly methods: suitable for all
   SMT assembly methods
• soldering methods: reflow soldering
• preconditioning: acc. to JEDEC Level 2
• taping: 12 mm tape with 1000/reel, ø180 mm
• ESD-withstand voltage: ESD senitive Device

APPLICATIONs
• indoor and outdoor displays (e.g. displays for
   traffic; light writing displays)
• LED chips can be controlled seperately to display
   various colors including white
• full color displays, RGB-Displays
• backlighting (LCD, illuminated advertising,
   general lighting)
• coupling into light guides