HIGH SPEED SENSITIVITY
Structure
1.1 Chip Size : 3.00mm X 3.00mm
1.2 Chip thickness : 400±20um
1.3 Metallization : Top - Al, Bottom - Au
1.4 Passivation : Silicon Oxide
1.5 Bonding Pad Size
- Anode(top) : 160um X 160um
1.6 Active Area : 2.86mm X 2.86mm