MPXC2011DT1, 0 to 10 kPa,
Differential, Compensated Pressure
Sensor

Freescale Semiconductor has developed a high volume, miniature pressure sensor package which is ideal as a sub-module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while providing an economic solution for the designer. This new chip carrier package uses Freescale Semiconductors unique sensor die with its piezoresistive technology, along with the added feature of on-chip, thin-film temperature compensation and calibration.

FEATUREs
• Integrated temperature compensation and calibration
• Ratiometric to supply voltage
• Polysulfone case material (ISO 10993)
• Provided in easy-to-use tape and reel

Typical applications
• Respiratory diagnostics
• Air movement control
• Controllers
• Pressure switching