DESCRIPTION
STATS ChipPAC’s LQFP is a low profile (1.4mm) version of the QFP. The LQFP is a leadframe based, plastic encapsulated
package with gull wing shaped leads on four sides. The LQFP offers pin counts up to 208, and is suitable for designs
with high I/Os while meeting low profile requirements and for mainstream cost sensitive applications.

FEATURES
• Body Sizes: 7 x 7mm to 28 x 28mm
• Package Height: 1.4mm
• Lead Counts: 32L to 208L
• Lead Pitch: 0.80mm to 0.40mm
• Wide range of open tool leadframe and die pad sizes available
• Moisture Sensitivity: JEDEC Level 3
• JEDEC standard compliant
• Lead-free and Green materials sets available
• Copper and alloy leadframes available

APPLICATIONS
• 3D Graphics
• Multimedia
• PC Chipsets
• Video / Audio
• Telecom
• Disc Drives
• Communication Boards (Ethernet, ISDN)