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ITG3200 データシート - Unspecified

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部品番号
ITG3200

コンポーネント説明

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39 Pages

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1 MB

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[InvenSense, Inc.]

Product Overview
The ITG-3200 is the world’s first single-chip, digital-output, 3-axis MEMS gyro IC optimized for gaming, 3D mice, and 3D remote control applications. The part features enhanced bias and sensitivity temperature stability, reducing the need for user calibration. Low frequency noise is lower than previous generation devices, simplifying application development and making for more-responsive remote controls.


APPLICATIONs
● Motion-enabled game controllers
● Motion-based portable gaming
● Motion-based 3D mice and 3D remote controls
● “No Touch” UI
● Health and sports monitoring


FEATUREs
The ITG-3200 triple-axis MEMS gyroscope includes a wide range of features:
● Digital-output X-, Y-, and Z-Axis angular rate sensors (gyros)
   on one integrated circuit with a sensitivity of
   14.375 LSBs per °/sec and a full-scale range of ±2000°/sec
● Three integrated 16-bit ADCs provide simultaneous sampling
   of gyros while requiring no external multiplexer
● Enhanced bias and sensitivity temperature stability reduces
   the need for user calibration
● Low frequency noise lower than previous generation devices,
   simplifying application development and making
   for more-responsive motion processing
● Digitally-programmable low-pass filter
● Low 6.5mA operating current consumption for long battery life
● Wide VDD supply voltage range of 2.1V to 3.6V
● Flexible VLOGIC reference voltage allows
   for I2C interface voltages from 1.71V to VDD
● Standby current: 5µA
● Smallest and thinnest package for portable devices (4x4x0.9mm QFN)
● No high pass filter needed
● Turn on time: 50ms
● Digital-output temperature sensor
● Factory calibrated scale factor
● 10,000 g shock tolerant
● Fast Mode I2C (400kHz) serial interface
● On-chip timing generator clock frequency
   is accurate to +/-2% over full temperature range
● Optional external clock inputs of 32.768kHz or 19.2MHz to
   synchronize with system clock
● MEMS structure hermetically sealed and bonded at wafer level
● RoHS and Green compliant

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部品番号
コンポーネント説明
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メーカー
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