DESCRIPTION
Third generation power MOSFETs from Vishay provides the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost effectiveness.
The TO-220 FULLPAK eliminates the need for additional insulating hardware in commercial-industrial applications. The molding compound used provides a high isolation capability and a low thermal resistance between the tab and external heatsink. This isolation is equivalent to using a 100 micron mica barrier with standard TO-220 product. The FULLPAK is mounted to a heatsink using a single clip or by a single screw fixing.

FEATURES
• Isolated package
• High voltage isolation = 2.5 kVRMS (t = 60 s;
   f = 60 Hz)
• Sink to lead creepage distance = 4.8 mm
• Dynamic dV/dt rating
• Low thermal resistance
• Material categorization: for definitions of compliance
   please see www.vishay.com/doc?99912