Description
These HEXFET® Power MOSFETs in package utilize the lastest processing techniques to achieve extremely low on-resistance per silicon area. Additional features of these HEXFET Power MOSFETs are a 150°C junction operating temperature, fast switching speed and improved repetitive avalanche rating. These benefits combine to make this design an extremely efficient and reliable device for use in a wide variety of applications.
The efficient SO-8 package provides enhanced thermal characteristics making it ideal in a variety of power applications. This surface mount SO-8 can dramatically reduce board space and is also available in Tape & Reel.

• Advanced Process Technology
• Ultra Low On-Resistance
• P Channel MOSFET
• Surface Mount
• Available in Tape & Reel
• 150°C Operating Temperature
• Lead-Free