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IRF640NS データシート - Kersemi Electronic Co., Ltd.

IRF640N image

部品番号
IRF640NS

コンポーネント説明

Other PDF
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page
11 Pages

File Size
463.8 kB

メーカー
KERSEMI
Kersemi Electronic Co., Ltd. KERSEMI

Description
The TO-220 package is universally preferred for all commercial-industrial applications at power dissipation levels to approximately 50 watts. The low thermal resistance and low package cost of the TO-220 contribute to its wide acceptance throughout the industry.
The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.
The through-hole version (IRF640NL) is available for low-profile application.

● Advanced Process Technology
● Dynamic dv/dt Rating
● 175°C Operating Temperature
● Fast Switching
● Fully Avalanche Rated
● Ease of Paralleling
● Simple Drive Requirements


部品番号
コンポーネント説明
PDF
メーカー
Advanced Process Technology
Kersemi Electronic Co., Ltd.
Advanced Process Technology
Kersemi Electronic Co., Ltd.
Advanced Process Technology
Kersemi Electronic Co., Ltd.
Advanced Process Technology ( Rev : V2 )
Kersemi Electronic Co., Ltd.
Advanced Process Technology
Kersemi Electronic Co., Ltd.
Advanced Process Technology
Kersemi Electronic Co., Ltd.
Advanced Process Technology
Kersemi Electronic Co., Ltd.
Advanced Process Technology
Silikron Semiconductor Co.,LTD.
Advanced Process Technology
Silikron Semiconductor Co.,LTD.
Advanced Process Technology
Kersemi Electronic Co., Ltd.

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