This HYB3164(5)405B is a 64 MBit dynamic RAM organized 16 777 216 by 4 bits. The device is fabricated in SIEMENS’most advanced 0,25 µm-CMOS silicon gate process technology. The circuit and process design allow this device to achieve high performance and low power dissipation. The HYB3164(5)405B operates with a single 3.3 +/-0.3V power supply and interfaces with either LVTTL or LVCMOS levels. Multiplexed address inputs permit the HYB 3164(5)400B to be packaged in a 400mil wide SOJ-32 or TSOP-32 plastic package. These packages provide high system bit densities and are compatible with commonly used automatic testing and insertion equipment.The HYB3164(5)405BTL parts have a very low power „sleep mode“ supported by Self Refresh.

Preliminary Information
• 16 777 216 words by 4-bit organization
• 0 to 70 °C operating temperature
• Hyper Page Mode - EDO - operation
• Performance:
• Single + 3.3 V (± 0.3V) power supply
• Low power dissipation:
    max. 306 active mW ( HYB 3164405BJ/BT(L)-40)
    max. 252 active mW ( HYB 3164405BJ/BT(L)-50)
    max. 216 active mW ( HYB 3164405BJ/BT(L)-60)
    max. 486 active mW ( HYB 3165405BJ/BT(L)-40)
    max. 396 active mW ( HYB 3165405BJ/BT(L)-50)
    max. 324 active mW ( HYB 3165405BJ/BT(L)-60)
    7.2 mW standby (LVTTL)
    3.6 mW standby (LVMOS)
    720 µA standby for L-version
• Read, write, read-modify-write, CAS-before-RAS refresh (CBR), RAS-only refresh, hidden refresh
• Self refresh (L-version only)
• 8192 refresh cycles/128 ms, 13 R/ 11C addresses (HYB 3164405BJ/BT)
    4096 refresh cycles / 64 ms, 12 R/ 12C addresses (HYB 3165405BJ/BT)
• 128 msec refresh period for L-versions
• Plastic Package:
    P-SOJ-32-1 400 mil HYB 3164(5)400BJ
    P-TSOPII-32-1 400 mil HYB 3164(5)400BT(L)