FEATURES
• Superectifier structure for high reliability condition
• Cavity-free glass-passivated junction
• Low leakage current, typical IR less than 0.1 µA
• Low forward voltage drop
• High forward surge capability
• Meets environmental standard MIL-S-19500
• Solder dip 260 °C, 40 s
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC