Features
• Glass passivated chip junction
• Integrally molded heatsink provides very low thermal
   Resistance for Maximm heat dissipation
• Universal 3-way terminals; snap-on, wire wrap-around
   Or P.C.B mounting
• Typical IR less than 0.3µA
• High forward surge current capability
• High temperature soldering guaranteed: 260˚C/10 seconds
   at 5lbs.(2.3kg) tension
• This series is UL recognized under component index,
   File number E194718
• RoHS Compliant