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GBPC1508TW データシート - GeneSiC Semiconductor, Inc.

GBPC1506TW image

部品番号
GBPC1508TW

Other PDF
  2016   2018  

PDF
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page
4 Pages

File Size
315.9 kB

メーカー
GENESIC
GeneSiC Semiconductor, Inc. GENESIC

Features
• Integrally molded heat sink provides low thermal resistance
   for maximum heat dissipation
• High surge current capability
• Void-free junction soldering by using vacuum soldering
• Universal 3-way terminals: snap on, wire-around, or P.C
   board mounting
• High temperature soldering guaranteed: 260°C/ 10
   seconds at 5 lbs (2.3 kg) tension
• Not ESD Sensitive

Mechanical Data
   Case: Molded plastic with heat sink integrally mounted in the bridge
   encapsulation
   Terminals: Either nickel plated 0.25". Faston lugs or copper leads
   0.040" diameter.
   Polarity: Polarrity symbols marked on the body
   Mounting position: Bolt down on heat-sink with silicone thermal
   compound between bridge and mounting surface
   Weight: 15 grams or 0.53 ounces
   Mounting torque: 20 inch-lbs max


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