General Description
Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ202P minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, high current handling capability, ultralow profile packaging, low gate charge, and low RDS(ON).
   
Features
• –5.5 A, –20 V. RDS(ON) = 0.045 Ω=@ VGS = –4.5 V
                          RDS(ON) = 0.075 Ω @ VGS = –2.5 V.
• Occupies only 5 mm2 of PCB area.
    Only 55% of the area of SSOT-6
• Ultra-thin package: less than 0.70 mm height when
    mounted to PCB
• Outstanding thermal transfer characteristics:
    4 times better than SSOT-6
• Ultra-low Qg x RDS(ON) figure-of-merit.
• High power and current handling capability.
   
Applications
• Battery management
• Load switch
• Battery protection