F3L75R07W2E3_B11(2010) データシート - Infineon Technologies
部品番号
F3L75R07W2E3_B11
コンポーネント説明
Other PDF
PDF
page
10 Pages
File Size
646.6 kB
メーカー
Infineon Technologies
Mechanical Features
• Al2O3 Substrate with Low Thermal Resistance
• Compact design
• Press FIT Contact Technology
• Rugged mounting due to integrated mounting clamps
Electrical Features
• Increased blocking voltage capability to 650V
• Low inductive design
• Low Switching Losses
• Low VCEsat
Typical Applications
• 3-Level-Applications
• Solar Applications
• UPS Systems
部品番号
コンポーネント説明
PDF
メーカー
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC ( Rev : 2010 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC ( Rev : 2010 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC ( Rev : 2010 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with fast Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and NTC ( Rev : 2009 )
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and NTC
Infineon Technologies
EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and NTC ( Rev : 2009 )
Infineon Technologies
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