Features:
• Glass passivated device
• Ideal for surface mouted applications
• Low reverse leakage
• Metallurgically bonded construction
• High temperature soldering guaranteed: 260 C/10 seconds,0.375”(9.5mm) lead length, 5 lbs. (2.3kg) tension
• This is a Pb − Free Device
• All SMC parts are traceable to the wafer lot
• Additional testing can be offered upon request

Mechanical Data:
• Case: JEDEC SOD-123SL molded plastic body over passivated chip
• Terminals: Plated axial leads, solderable per MIL-STD-750, Method 2026
• Polarity: Color band denotes cathode end
• Mounting Position: Any
• Weight: 0.00058 ounce, 0.0165 grams