Features
● Glass passivated chip junction
● Ideal for automated placement
● Ultrafast reverse recovery time for high efficiency
● Low profile package
● High forward surage capability
● High temperatrue soldering˖
   260°C/10 seconds at terminals
● Component in accordance to RoHS 2002/95/1
   and WEEE 2002/96/EC

Mechanical Date
● Case: JEDEC DO-214AC molded plastic
   body over passivated chip
● Terminals: Solder plated, solderable per
   J-STD-002B and JESD22-B102D
● Polarity: Laser band denotes cathode end