■ Features
● Low DCR and large current capability, suitable for power circuitry.
● Wire wound, resin molded chip inductor. (PC, PA, PB, LC, LA type)
● Unique Ceramic Core/Laser-cut technology (PF, PE type)
● Capable of being Re-fl ow or fl ow soldered.
● Wide line-up from 1005 to 4532 case sizes.
● Good for mounting.
● RoHS compliant

■ Recommended Applications
● AV equipment, Wireless communication equipment and various types of general electronic equipment.