FEATURES
• Glass passivated chip junction
• High breakdown voltage capability
• Very fast reverse recovery time
• Fast forward recovery time
• High efficiency, low switching losses
• Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package)
• Solder dip 260 °C, 40 s (for TO-220AC and ITO-220AC package)
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

TYPICAL APPLICATIONS
    For use in high resolution display TV and monitor horizontal deflection application.