FEATURES
● SUGGESTED REPLACEMENT FOR MR751, MR752, MR754, MR756 DIODES
● VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)
● LARGE DIE FOR HIGH POWER HEAVY DUTY PERFORMANCE
● HIGH HEAT HANDLING CAPABILITY WITH VERY LOW THERMAL STRESS
● PROPRIETARY JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE
● LOW FORWARD VOLTAGE DROP