FEATURES
● Stability ΔR/R = 1 % for 1000 h at 70 ° C
● 2 mm pitch packaging option for 0603 size
● Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes
● Metal glaze on high quality ceramic
● AEC-Q200 qualified
● Material categorization: For definitions of compliance please see www.vishay.com/doc?99912