PROCESS DETAILS
   Die Size 25 x 25 MILS
   Die Thickness 6.0 MILS
   Bonding Pad Area 1 (+DC) 3.0 x 3.0 MILS
   Bonding Pad Area 2 (AC) 3.0 x 7.0 MILS
   Bonding Pad Area 3 (-DC) 3.0 x 4.0 MILS
   Bonding Pad Area 4 (AC) 3.0 x 7.0 MILS
   Top Side Metalization Al - 12,000Å
   Back Side Metalization Au - 5,000Å