CP788X データシート - Central Semiconductor
部品番号
CP788X
Other PDF
no available.
PDF
page
2 Pages
File Size
697.5 kB
メーカー
Central Semiconductor
PROCESS DETAILS
Process EPITAXIAL PLANAR
Die Size 13.7 x 13.7 MILS
Die Thickness 5.9 MILS
Base Bonding Pad Area 4.0 x 4.0 MILS
Emitter Bonding Pad Area 5.5 x 5.5 MILS
Top Side Metalization Al-Si - 30,000Å
Back Side Metalization Au - 12,000Å
部品番号
コンポーネント説明
PDF
メーカー
Small Signal Transistor PNP - Low Noise Amplifier Transistor Chip ( Rev : 2002 )
Central Semiconductor
Small Signal Transistor NPN - Low Noise Amplifier Transistor Chip ( Rev : 2002 )
Central Semiconductor
Small Signal Transistor PNP - Darlington Transistor Chip ( Rev : 2002 )
Central Semiconductor
Share Link: